MICRAM project aims to recover critical raw materials from end-of-life electronic board. The target element for the project is the nickel which is mainly present in the coatings of several electronic components. The recovery process starts with an innovative technique of desoldering by impact, under patenting. Impact desoldering allows removal of the soldering alloy and the consequent separation of the electronic components from the PCB, with minimal residual contamination. Electronic components are used to extract critical raw materials whereas clean PCB can be destined to the copper extraction. Nickel has been found in many components after impact desoldering and has been extracted by liquid metallurgy.
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